Chainmail-like material could be the future of armor
Chainmail-like material could be the future of armor
January 16, 2025
Will Dichtel and researchers from the Dichtel Group have unveiled the first 2D mechanically interlocked polymer. This nanoscale material, resembling chainmail, offers exceptional flexibility and strength. With potential applications in lightweight body armor, this innovation represents a significant breakthrough in durable, high-performance materials.
